Silicon integrated circuits, which are used in computer processors, are approaching the maximum feasible density of transistors on a single chip—at least, in two-dimensional arrays. Now, a team of engineers at U-M have stacked a second layer of transistors directly atop a state-of-the-art silicon chip.
They propose that their design could remove the need for a second chip that converts between high- and-low voltage signals, which currently stands between the low-voltage processing chips and the higher-voltage user interfaces. “Our approach can achieve better performance in a smaller, lighter package,” said Becky Peterson, an associate professor of electrical engineering and computer science and project leader.
