{"id":11602,"date":"2019-01-02T11:29:51","date_gmt":"2019-01-02T16:29:51","guid":{"rendered":"https:\/\/michigan.it.umich.edu\/news\/?p=11602"},"modified":"2024-07-08T06:05:38","modified_gmt":"2024-07-08T10:05:38","slug":"bridging-the-last-centimeter-barrier-in-electronic-communications","status":"publish","type":"post","link":"https:\/\/michigan.it.umich.edu\/news\/2019\/01\/02\/bridging-the-last-centimeter-barrier-in-electronic-communications\/","title":{"rendered":"Bridging the &#8220;last centimeter barrier&#8221; in electronic communications"},"content":{"rendered":"\n<figure class=\"wp-block-image\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"421\" src=\"https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg\" alt=\"spoof surface plasmon polariton (SSPP) computer chip\" class=\"wp-image-11604\" srcset=\"https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg 600w, https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip-200x140.jpg 200w, https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip-285x200.jpg 285w, https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip-60x42.jpg 60w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><figcaption>(EECS)<\/figcaption><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Michigan Engineering researchers are addressing a performance bottleneck that currently exists in the information transfer between electronic chips located a few centimeters apart in a computing system. Led by\u00a0electrical engineering professor <strong>Pinaki Mazumder<\/strong>, their work \u2013 <a href=\"https:\/\/eecs.umich.edu\/eecs\/about\/articles\/2018\/last-centimeter-barrier.html\">dubbed the &#8220;last centimeter barrier&#8221;<\/a> \u2013 will enable a new generation of electronic systems with ultra high speed data transfers.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Electronic chips currently use metallic wires to connect internal building blocks and circuit elements. For long-distance and higher-speed applications, connections are made via much faster optical interconnects. <\/p>\n\n\n\n<p class=\"wp-block-paragraph\">However,  traditional metal interconnects have bandwidth limitations and can be susceptible to crosstalk at high speed. Optical interconnects are not energy-efficient for short range communications of 15 cm or less and are, therefore, not suitable for chip-to-chip applications. <\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Identifying an alternative high-speed interface without these shortcomings has remained an open challenge, one that Mazumder and his colleagues seek to solve using a new type of channel to transfer signals.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Michigan Engineering researchers are addressing a performance bottleneck that currently exists in the information transfer between electronic chips located a few centimeters apart in a computing system. Led by\u00a0electrical engineering professor Pinaki Mazumder, their work \u2013 dubbed the &#8220;last centimeter barrier&#8221; \u2013 will enable a new generation of electronic systems with ultra high speed data transfers. Electronic chips\u2026 <span class=\"read-more\"><a href=\"https:\/\/michigan.it.umich.edu\/news\/2019\/01\/02\/bridging-the-last-centimeter-barrier-in-electronic-communications\/\">Read More &raquo;<\/a><\/span><\/p>\n","protected":false},"author":1,"featured_media":11604,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_uag_custom_page_level_css":"","_umich_oidc_access":"","_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"_ef_editorial_meta_date_first-draft-date":"","_ef_editorial_meta_paragraph_assignment":"","_ef_editorial_meta_checkbox_needs-photo":"","_ef_editorial_meta_number_word-count":"","footnotes":""},"categories":[5],"tags":[290,270,21,534],"class_list":["post-11602","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-campus-news","tag-coe","tag-hardware","tag-innovation","tag-microchip"],"uagb_featured_image_src":{"full":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg",600,421,false],"thumbnail":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip-200x140.jpg",200,140,true],"medium":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip-285x200.jpg",285,200,true],"medium_large":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg",600,421,false],"large":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg",600,421,false],"1536x1536":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg",600,421,false],"2048x2048":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg",600,421,false],"excerpt-thumbnail":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip-200x140.jpg",200,140,true],"themonic-thumbnail":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip-60x42.jpg",60,42,true],"ioslider-thumbnail":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip-600x300.jpg",600,300,true],"post-thumbnail":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg",600,421,false],"400x250-crop":["https:\/\/michigan.it.umich.edu\/news\/wp-content\/uploads\/2019\/01\/computer-chip.jpg",356,250,false]},"uagb_author_info":{"display_name":"News Staff","author_link":"https:\/\/michigan.it.umich.edu\/news\/author\/mitnewsadm\/"},"uagb_comment_info":0,"uagb_excerpt":"Michigan Engineering researchers are addressing a performance bottleneck that currently exists in the information transfer between electronic chips located a few centimeters apart in a computing system. Led by\u00a0electrical engineering professor Pinaki Mazumder, their work \u2013 dubbed the &#8220;last centimeter barrier&#8221; \u2013 will enable a new generation of electronic systems with ultra high speed data&hellip;","_links":{"self":[{"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/posts\/11602","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/comments?post=11602"}],"version-history":[{"count":3,"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/posts\/11602\/revisions"}],"predecessor-version":[{"id":11607,"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/posts\/11602\/revisions\/11607"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/media\/11604"}],"wp:attachment":[{"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/media?parent=11602"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/categories?post=11602"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/michigan.it.umich.edu\/news\/wp-json\/wp\/v2\/tags?post=11602"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}